e4b91c4846
The code to select names for the bonding interfaces was, for the non-sysfs creation case, always using a hard-coded set of bond0, bond1, etc, up to max_bonds. This caused conflicts for the second or subsequent loads of the module. Changed the code to obtain device names from dev_alloc_name(). Signed-off-by: Jay Vosburgh <fubar@us.ibm.com> Signed-off-by: Jeff Garzik <jeff@garzik.org> |
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| .. | ||
| bond_3ad.c | ||
| bond_3ad.h | ||
| bond_alb.c | ||
| bond_alb.h | ||
| bond_main.c | ||
| bond_sysfs.c | ||
| bonding.h | ||
| Makefile | ||