d28a9689c9
Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>
24 lines
712 B
C
24 lines
712 B
C
/**
|
|
* dwc3-exynos.h - Samsung EXYNOS DWC3 Specific Glue layer, header.
|
|
*
|
|
* Copyright (c) 2012 Samsung Electronics Co., Ltd.
|
|
* http://www.samsung.com
|
|
*
|
|
* Author: Anton Tikhomirov <av.tikhomirov@samsung.com>
|
|
*
|
|
* This program is free software; you can redistribute it and/or modify
|
|
* it under the terms of the GNU General Public License as published by
|
|
* the Free Software Foundation; either version 2 of the License, or
|
|
* (at your option) any later version.
|
|
*/
|
|
|
|
#ifndef _DWC3_EXYNOS_H_
|
|
#define _DWC3_EXYNOS_H_
|
|
|
|
struct dwc3_exynos_data {
|
|
int phy_type;
|
|
int (*phy_init)(struct platform_device *pdev, int type);
|
|
int (*phy_exit)(struct platform_device *pdev, int type);
|
|
};
|
|
|
|
#endif /* _DWC3_EXYNOS_H_ */
|