Javier Martinez Canillas 9ad1df2b15 ARM: dts: omap3: Add support for IGEP COM Module ... ISEE IGEP COM Module is an TI OMAP3 SoC computer on module. This patch adds an initial device tree support to boot an IGEP COM Module from the MMC/SD. Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk> Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com> [b-cousson@ti.com: Update the Makefile for 3.8-rc2] Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>		2013-04-09 00:16:46 +02:00
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bootp
compressed	ARM: 7666/1: decompressor: add -mno-single-pic-base for building the decompressor	2013-03-06 23:45:42 +00:00
dts	ARM: dts: omap3: Add support for IGEP COM Module	2013-04-09 00:16:46 +02:00
.gitignore
install.sh
Makefile	ARM: dts: remove generated .dtb files on clean	2013-03-04 17:15:35 -08:00