kernel-fxtec-pro1x/drivers/usb/dwc3
Greg Kroah-Hartman 3d71769014 usb: dwc3: changes for v3.4 merge window
Here are the changes for v3.4 merge window.
 
 It includes a new glue layer for Samsung's Exynos platform, a simplification of
 memory management on DWC3 driver by using dev_xxx functions, a few
 optimizations to IRQ handling by dropping memcpy() and using bitshifts, a fix
 for TI's OMAP5430 TX Fifo Allocation, two fixes on USB2 test mode
 implementation (one on debugfs and one on ep0), and several minor changes such
 as whitespace cleanups, simplification of a few parts of the code, decreasing a
 long delay to something a bit saner, dropping a header which was included twice
 and so on.
 
 The highlight on this merge is the support for Samsung's Exynos platform,
 increasing the number of different users for this driver to three.
 
 Note that Samsung Exynos glue layer will only compile on platforms which
 provide implementation for the clk API for now. Once Samsung supports
 pm_runtime, that limitation can be dropped from the Makefile.
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Merge tag 'dwc3-for-v3.4' of git://git.kernel.org/pub/scm/linux/kernel/git/balbi/usb into usb-next

usb: dwc3: changes for v3.4 merge window

Here are the changes for v3.4 merge window.

It includes a new glue layer for Samsung's Exynos platform, a simplification of
memory management on DWC3 driver by using dev_xxx functions, a few
optimizations to IRQ handling by dropping memcpy() and using bitshifts, a fix
for TI's OMAP5430 TX Fifo Allocation, two fixes on USB2 test mode
implementation (one on debugfs and one on ep0), and several minor changes such
as whitespace cleanups, simplification of a few parts of the code, decreasing a
long delay to something a bit saner, dropping a header which was included twice
and so on.

The highlight on this merge is the support for Samsung's Exynos platform,
increasing the number of different users for this driver to three.

Note that Samsung Exynos glue layer will only compile on platforms which
provide implementation for the clk API for now. Once Samsung supports
pm_runtime, that limitation can be dropped from the Makefile.

Conflicts:
	drivers/usb/dwc3/gadget.c
2012-03-02 15:56:33 -08:00
..
core.c usb: dwc3: replace hard-coded constant in DWC3_GCTL_SCALEDOWN(3) 2012-03-02 12:12:06 +02:00
core.h usb: dwc3: changes for v3.4 merge window 2012-03-02 15:56:33 -08:00
debug.h usb: dwc: remove "All rights reserved" statement. 2011-10-04 10:25:52 -07:00
debugfs.c usb: dwc3: debugfs: fix off by one when entering testmode 2012-02-10 12:14:53 +02:00
dwc3-exynos.c usb: dwc3: Add Exynos Specific Glue layer 2012-03-02 12:11:28 +02:00
dwc3-omap.c usb: dwc3: linux/module.h included twice 2012-03-02 12:12:00 +02:00
dwc3-pci.c usb: dwc3: pci: fix failure path in dwc3_pci_probe() 2012-03-02 12:12:07 +02:00
ep0.c usb: dwc3: changes for v3.4 merge window 2012-03-02 15:56:33 -08:00
gadget.c usb: dwc3: changes for v3.4 merge window 2012-03-02 15:56:33 -08:00
gadget.h usb: dwc3: changes for v3.4 merge window 2012-03-02 15:56:33 -08:00
host.c usb: dwc3: host: align on host device name 2012-02-06 11:48:42 +02:00
io.h usb: dwc3: fix few coding style problems 2011-12-12 11:48:29 +02:00
Kconfig usb: dwc3: depend on both Host and Gadget stacks 2011-12-12 11:48:14 +02:00
Makefile usb: dwc3: Add Exynos Specific Glue layer 2012-03-02 12:11:28 +02:00