ec2feb475f
Move the dependencies to menu, so we avoid showing it wrongly. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-omap@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
377 lines
13 KiB
Text
377 lines
13 KiB
Text
#
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# Generic thermal sysfs drivers configuration
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#
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menuconfig THERMAL
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tristate "Generic Thermal sysfs driver"
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help
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Generic Thermal Sysfs driver offers a generic mechanism for
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thermal management. Usually it's made up of one or more thermal
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zone and cooling device.
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Each thermal zone contains its own temperature, trip points,
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cooling devices.
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All platforms with ACPI thermal support can use this driver.
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If you want this support, you should say Y or M here.
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if THERMAL
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config THERMAL_HWMON
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bool
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prompt "Expose thermal sensors as hwmon device"
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depends on HWMON=y || HWMON=THERMAL
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default y
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help
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In case a sensor is registered with the thermal
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framework, this option will also register it
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as a hwmon. The sensor will then have the common
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hwmon sysfs interface.
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Say 'Y' here if you want all thermal sensors to
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have hwmon sysfs interface too.
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config THERMAL_OF
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bool
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prompt "APIs to parse thermal data out of device tree"
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depends on OF
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default y
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help
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This options provides helpers to add the support to
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read and parse thermal data definitions out of the
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device tree blob.
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Say 'Y' here if you need to build thermal infrastructure
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based on device tree.
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config THERMAL_WRITABLE_TRIPS
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bool "Enable writable trip points"
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help
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This option allows the system integrator to choose whether
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trip temperatures can be changed from userspace. The
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writable trips need to be specified when setting up the
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thermal zone but the choice here takes precedence.
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Say 'Y' here if you would like to allow userspace tools to
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change trip temperatures.
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choice
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prompt "Default Thermal governor"
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default THERMAL_DEFAULT_GOV_STEP_WISE
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help
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This option sets which thermal governor shall be loaded at
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startup. If in doubt, select 'step_wise'.
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config THERMAL_DEFAULT_GOV_STEP_WISE
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bool "step_wise"
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select THERMAL_GOV_STEP_WISE
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help
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Use the step_wise governor as default. This throttles the
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devices one step at a time.
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config THERMAL_DEFAULT_GOV_FAIR_SHARE
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bool "fair_share"
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select THERMAL_GOV_FAIR_SHARE
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help
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Use the fair_share governor as default. This throttles the
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devices based on their 'contribution' to a zone. The
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contribution should be provided through platform data.
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config THERMAL_DEFAULT_GOV_USER_SPACE
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bool "user_space"
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select THERMAL_GOV_USER_SPACE
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help
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Select this if you want to let the user space manage the
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platform thermals.
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config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
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bool "power_allocator"
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select THERMAL_GOV_POWER_ALLOCATOR
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help
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Select this if you want to control temperature based on
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system and device power allocation. This governor can only
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operate on cooling devices that implement the power API.
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endchoice
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config THERMAL_GOV_FAIR_SHARE
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bool "Fair-share thermal governor"
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help
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Enable this to manage platform thermals using fair-share governor.
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config THERMAL_GOV_STEP_WISE
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bool "Step_wise thermal governor"
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help
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Enable this to manage platform thermals using a simple linear
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governor.
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config THERMAL_GOV_BANG_BANG
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bool "Bang Bang thermal governor"
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default n
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help
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Enable this to manage platform thermals using bang bang governor.
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Say 'Y' here if you want to use two point temperature regulation
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used for fans without throttling. Some fan drivers depend on this
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governor to be enabled (e.g. acerhdf).
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config THERMAL_GOV_USER_SPACE
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bool "User_space thermal governor"
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help
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Enable this to let the user space manage the platform thermals.
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config THERMAL_GOV_POWER_ALLOCATOR
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bool "Power allocator thermal governor"
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help
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Enable this to manage platform thermals by dynamically
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allocating and limiting power to devices.
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config CPU_THERMAL
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bool "generic cpu cooling support"
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depends on CPU_FREQ
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depends on THERMAL_OF
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help
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This implements the generic cpu cooling mechanism through frequency
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reduction. An ACPI version of this already exists
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(drivers/acpi/processor_thermal.c).
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This will be useful for platforms using the generic thermal interface
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and not the ACPI interface.
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If you want this support, you should say Y here.
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config CLOCK_THERMAL
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bool "Generic clock cooling support"
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depends on COMMON_CLK
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depends on PM_OPP
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help
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This entry implements the generic clock cooling mechanism through
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frequency clipping. Typically used to cool off co-processors. The
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device that is configured to use this cooling mechanism will be
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controlled to reduce clock frequency whenever temperature is high.
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If you want this support, you should say Y here.
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config THERMAL_EMULATION
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bool "Thermal emulation mode support"
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help
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Enable this option to make a emul_temp sysfs node in thermal zone
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directory to support temperature emulation. With emulation sysfs node,
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user can manually input temperature and test the different trip
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threshold behaviour for simulation purpose.
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WARNING: Be careful while enabling this option on production systems,
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because userland can easily disable the thermal policy by simply
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flooding this sysfs node with low temperature values.
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config HISI_THERMAL
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tristate "Hisilicon thermal driver"
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depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
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help
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Enable this to plug hisilicon's thermal sensor driver into the Linux
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thermal framework. cpufreq is used as the cooling device to throttle
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CPUs when the passive trip is crossed.
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config IMX_THERMAL
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tristate "Temperature sensor driver for Freescale i.MX SoCs"
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depends on CPU_THERMAL
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depends on MFD_SYSCON
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depends on OF
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help
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Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
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It supports one critical trip point and one passive trip point. The
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cpufreq is used as the cooling device to throttle CPUs when the
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passive trip is crossed.
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config SPEAR_THERMAL
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bool "SPEAr thermal sensor driver"
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depends on PLAT_SPEAR || COMPILE_TEST
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depends on OF
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help
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Enable this to plug the SPEAr thermal sensor driver into the Linux
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thermal framework.
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config ROCKCHIP_THERMAL
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tristate "Rockchip thermal driver"
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depends on ARCH_ROCKCHIP || COMPILE_TEST
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depends on RESET_CONTROLLER
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help
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Rockchip thermal driver provides support for Temperature sensor
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ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
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trip point. Cpufreq is used as the cooling device and will throttle
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CPUs when the Temperature crosses the passive trip point.
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config RCAR_THERMAL
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tristate "Renesas R-Car thermal driver"
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depends on ARCH_SHMOBILE || COMPILE_TEST
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depends on HAS_IOMEM
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help
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Enable this to plug the R-Car thermal sensor driver into the Linux
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thermal framework.
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config KIRKWOOD_THERMAL
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tristate "Temperature sensor on Marvell Kirkwood SoCs"
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depends on MACH_KIRKWOOD || COMPILE_TEST
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depends on OF
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help
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Support for the Kirkwood thermal sensor driver into the Linux thermal
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framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
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config DOVE_THERMAL
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tristate "Temperature sensor on Marvell Dove SoCs"
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depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
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depends on OF
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help
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Support for the Dove thermal sensor driver in the Linux thermal
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framework.
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config DB8500_THERMAL
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bool "DB8500 thermal management"
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depends on ARCH_U8500
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default y
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help
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Adds DB8500 thermal management implementation according to the thermal
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management framework. A thermal zone with several trip points will be
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created. Cooling devices can be bound to the trip points to cool this
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thermal zone if trip points reached.
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config ARMADA_THERMAL
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tristate "Armada 370/XP thermal management"
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depends on ARCH_MVEBU || COMPILE_TEST
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depends on OF
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help
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Enable this option if you want to have support for thermal management
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controller present in Armada 370 and Armada XP SoC.
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config TEGRA_SOCTHERM
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tristate "Tegra SOCTHERM thermal management"
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depends on ARCH_TEGRA
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help
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Enable this option for integrated thermal management support on NVIDIA
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Tegra124 systems-on-chip. The driver supports four thermal zones
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(CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
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zones to manage temperatures. This option is also required for the
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emergency thermal reset (thermtrip) feature to function.
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config DB8500_CPUFREQ_COOLING
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tristate "DB8500 cpufreq cooling"
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depends on ARCH_U8500
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depends on CPU_THERMAL
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default y
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help
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Adds DB8500 cpufreq cooling devices, and these cooling devices can be
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bound to thermal zone trip points. When a trip point reached, the
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bound cpufreq cooling device turns active to set CPU frequency low to
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cool down the CPU.
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config INTEL_POWERCLAMP
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tristate "Intel PowerClamp idle injection driver"
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depends on THERMAL
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depends on X86
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depends on CPU_SUP_INTEL
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help
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Enable this to enable Intel PowerClamp idle injection driver. This
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enforce idle time which results in more package C-state residency. The
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user interface is exposed via generic thermal framework.
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config X86_PKG_TEMP_THERMAL
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tristate "X86 package temperature thermal driver"
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depends on X86_THERMAL_VECTOR
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select THERMAL_GOV_USER_SPACE
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default m
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help
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Enable this to register CPU digital sensor for package temperature as
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thermal zone. Each package will have its own thermal zone. There are
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two trip points which can be set by user to get notifications via thermal
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notification methods.
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config INTEL_SOC_DTS_IOSF_CORE
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tristate
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depends on X86
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select IOSF_MBI
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help
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This is becoming a common feature for Intel SoCs to expose the additional
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digital temperature sensors (DTSs) using side band interface (IOSF). This
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implements the common set of helper functions to register, get temperature
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and get/set thresholds on DTSs.
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config INTEL_SOC_DTS_THERMAL
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tristate "Intel SoCs DTS thermal driver"
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depends on X86
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select INTEL_SOC_DTS_IOSF_CORE
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help
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Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
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temperature sensor (DTS). These SoCs have two additional DTSs in
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addition to DTSs on CPU cores. Each DTS will be registered as a
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thermal zone. There are two trip points. One of the trip point can
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be set by user mode programs to get notifications via Linux thermal
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notification methods.The other trip is a critical trip point, which
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was set by the driver based on the TJ MAX temperature.
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config INTEL_QUARK_DTS_THERMAL
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tristate "Intel Quark DTS thermal driver"
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depends on X86_INTEL_QUARK
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help
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Enable this to register Intel Quark SoC (e.g. X1000) platform digital
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temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
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The DTS will be registered as a thermal zone. There are two trip points:
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hot & critical. The critical trip point default value is set by
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underlying BIOS/Firmware.
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config INT340X_THERMAL
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tristate "ACPI INT340X thermal drivers"
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depends on X86 && ACPI
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select THERMAL_GOV_USER_SPACE
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select ACPI_THERMAL_REL
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select ACPI_FAN
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select INTEL_SOC_DTS_IOSF_CORE
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help
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Newer laptops and tablets that use ACPI may have thermal sensors and
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other devices with thermal control capabilities outside the core
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CPU/SOC, for thermal safety reasons.
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They are exposed for the OS to use via the INT3400 ACPI device object
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as the master, and INT3401~INT340B ACPI device objects as the slaves.
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Enable this to expose the temperature information and cooling ability
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from these objects to userspace via the normal thermal framework.
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This means that a wide range of applications and GUI widgets can show
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the information to the user or use this information for making
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decisions. For example, the Intel Thermal Daemon can use this
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information to allow the user to select his laptop to run without
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turning on the fans.
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config ACPI_THERMAL_REL
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tristate
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depends on ACPI
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config INTEL_PCH_THERMAL
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tristate "Intel PCH Thermal Reporting Driver"
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depends on X86 && PCI
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help
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Enable this to support thermal reporting on certain intel PCHs.
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Thermal reporting device will provide temperature reading,
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programmable trip points and other information.
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menu "Texas Instruments thermal drivers"
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depends on ARCH_HAS_BANDGAP || COMPILE_TEST
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source "drivers/thermal/ti-soc-thermal/Kconfig"
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endmenu
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menu "Samsung thermal drivers"
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depends on ARCH_EXYNOS || COMPILE_TEST
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source "drivers/thermal/samsung/Kconfig"
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endmenu
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menu "STMicroelectronics thermal drivers"
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depends on ARCH_STI && OF
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source "drivers/thermal/st/Kconfig"
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endmenu
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config QCOM_SPMI_TEMP_ALARM
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tristate "Qualcomm SPMI PMIC Temperature Alarm"
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depends on OF && (SPMI || COMPILE_TEST) && IIO
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select REGMAP_SPMI
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help
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This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
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PMIC devices. It shows up in sysfs as a thermal sensor with multiple
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trip points. The temperature reported by the thermal sensor reflects the
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real time die temperature if an ADC is present or an estimate of the
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temperature based upon the over temperature stage value.
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endif
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