Register hwmon device as last operation in the probe function to ensure that all
attribute files exist when accessed from user applications. Otherwise, there
is a short time frame where the device is registered as hwmon device but
sysfs attributes do not yet exist. This could result in applications erroneously
not detecting attributes.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
This patch converts the drivers in drivers/hwmon/* to use the
module_spi_driver() macro which makes the code smaller and a bit simpler.
Signed-off-by: Axel Lin <axel.lin@gmail.com>
Cc: Sonic Zhang <sonic.zhang@analog.com>
Cc: Marc Pignat <marc.pignat@hevs.ch>
Cc: Paul Thomas <pthomas8589@gmail.com>
Cc: Eric Miao <eric.y.miao@gmail.com>
Acked-by: Sonic Zhang <sonic.zhang@analog.com>
Signed-off-by: Guenter Roeck <guenter.roeck@ericsson.com>
fixed:
ERROR: spaces required around that '=' (ctx:VxV)
#60: FILE: lm70.c:60:
+ s16 raw=0;
^
ERROR: do not use assignment in if condition
#168: FILE: lm70.c:168:
+ if ((status = device_create_file(&spi->dev, &dev_attr_temp1_input))
Signed-off-by: Frans Meulenbroeks <fransmeulenbroeks@gmail.com>
Signed-off-by: Guenter Roeck <guenter.roeck@ericsson.com>
Use helper functions to set and get driver data. This is more elegant.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Andreas Herrmann <andreas.herrmann3@amd.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
percpu.h is included by sched.h and module.h and thus ends up being
included when building most .c files. percpu.h includes slab.h which
in turn includes gfp.h making everything defined by the two files
universally available and complicating inclusion dependencies.
percpu.h -> slab.h dependency is about to be removed. Prepare for
this change by updating users of gfp and slab facilities include those
headers directly instead of assuming availability. As this conversion
needs to touch large number of source files, the following script is
used as the basis of conversion.
http://userweb.kernel.org/~tj/misc/slabh-sweep.py
The script does the followings.
* Scan files for gfp and slab usages and update includes such that
only the necessary includes are there. ie. if only gfp is used,
gfp.h, if slab is used, slab.h.
* When the script inserts a new include, it looks at the include
blocks and try to put the new include such that its order conforms
to its surrounding. It's put in the include block which contains
core kernel includes, in the same order that the rest are ordered -
alphabetical, Christmas tree, rev-Xmas-tree or at the end if there
doesn't seem to be any matching order.
* If the script can't find a place to put a new include (mostly
because the file doesn't have fitting include block), it prints out
an error message indicating which .h file needs to be added to the
file.
The conversion was done in the following steps.
1. The initial automatic conversion of all .c files updated slightly
over 4000 files, deleting around 700 includes and adding ~480 gfp.h
and ~3000 slab.h inclusions. The script emitted errors for ~400
files.
2. Each error was manually checked. Some didn't need the inclusion,
some needed manual addition while adding it to implementation .h or
embedding .c file was more appropriate for others. This step added
inclusions to around 150 files.
3. The script was run again and the output was compared to the edits
from #2 to make sure no file was left behind.
4. Several build tests were done and a couple of problems were fixed.
e.g. lib/decompress_*.c used malloc/free() wrappers around slab
APIs requiring slab.h to be added manually.
5. The script was run on all .h files but without automatically
editing them as sprinkling gfp.h and slab.h inclusions around .h
files could easily lead to inclusion dependency hell. Most gfp.h
inclusion directives were ignored as stuff from gfp.h was usually
wildly available and often used in preprocessor macros. Each
slab.h inclusion directive was examined and added manually as
necessary.
6. percpu.h was updated not to include slab.h.
7. Build test were done on the following configurations and failures
were fixed. CONFIG_GCOV_KERNEL was turned off for all tests (as my
distributed build env didn't work with gcov compiles) and a few
more options had to be turned off depending on archs to make things
build (like ipr on powerpc/64 which failed due to missing writeq).
* x86 and x86_64 UP and SMP allmodconfig and a custom test config.
* powerpc and powerpc64 SMP allmodconfig
* sparc and sparc64 SMP allmodconfig
* ia64 SMP allmodconfig
* s390 SMP allmodconfig
* alpha SMP allmodconfig
* um on x86_64 SMP allmodconfig
8. percpu.h modifications were reverted so that it could be applied as
a separate patch and serve as bisection point.
Given the fact that I had only a couple of failures from tests on step
6, I'm fairly confident about the coverage of this conversion patch.
If there is a breakage, it's likely to be something in one of the arch
headers which should be easily discoverable easily on most builds of
the specific arch.
Signed-off-by: Tejun Heo <tj@kernel.org>
Guess-its-ok-by: Christoph Lameter <cl@linux-foundation.org>
Cc: Ingo Molnar <mingo@redhat.com>
Cc: Lee Schermerhorn <Lee.Schermerhorn@hp.com>
Make the code a little bit nicer, and shorter.
Signed-off-by: Anton Vorontsov <avorontsov@ru.mvista.com>
Cc: Kaiwan N Billimoria <kaiwan@designergraphix.com>
Cc: David Brownell <dbrownell@users.sourceforge.net>
Cc: David Woodhouse <dwmw2@infradead.org>
Cc: Grant Likely <grant.likely@secretlab.ca>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Ben Dooks <ben-linux@fluff.org>
Cc: Benjamin Herrenschmidt <benh@kernel.crashing.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
The Texas Instruments TMP121 is a SPI temperature sensor very similar
to the LM70, with slightly higher resolution. This patch extends the
LM70 driver to support the TMP121. The TMP123 differs in pin assign-
ment.
Signed-off-by: Manuel Lauss <mano@roarinelk.homelinux.net>
Signed-off-by: Jean Delvare <khali@linux-fr.org>
This fixes a byteswap bug in the LM70 temperature sensor driver,
which was previously covered up by a converse bug in the driver
for the LM70EVAL-LLP board (which is also fixed).
Other fixes: doc updates, remove an annoying msleep(), and improve
three-wire protocol handling.
Signed-off-by: Kaiwan N Billimoria <kaiwan@designergraphix.com>
[ dbrownell@users.sourceforge.net: doc and whitespace tweaks ]
Signed-off-by: David Brownell <dbrownell@users.sourceforge.net>
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Matthias Kaehlcke <matthias.kaehlcke@gmail.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Mark M. Hoffman <mhoffman@lightlink.com>
Convert from class_device to device for hwmon_device_register/unregister
Signed-off-by: Tony Jones <tonyj@suse.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
Signed-off-by: Kay Sievers <kay.sievers@vrfy.org>
Signed-off-by: Mark M. Hoffman <mhoffman@lightlink.com>
Add a name attribute to the lm70 devices. This is required for
libsensors to recognize them.
Also drop the "+" before the temperature value, even though it did
not cause problems to libsensors, other hardware monitoring drivers
don't print it, so it's more consistent that way.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Hans de Goede <j.w.r.degoede@hhs.nl>
Acked-by: Kaiwan <kaiwan@designergraphix.com>
Signed-off-by: Mark M. Hoffman <mhoffman@lightlink.com>
Add a new spi->mode bit: SPI_3WIRE, for chips where the SI and SO signals
are shared (and which are thus only half duplex). Update the LM70 driver
to require support for that hardware mode from the controller.
Signed-off-by: David Brownell <dbrownell@users.sourceforge.net>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
This driver implements support for the National Semiconductor LM70
temperature sensor.
The LM70 temperature sensor chip supports a single temperature sensor.
It communicates with a host processor (or microcontroller) via an
SPI/Microwire Bus interface.
Communication with the LM70 is simple: when the temperature is to be sensed,
the driver accesses the LM70 using SPI communication: 16 SCLK cycles
comprise the MOSI/MISO loop. At the end of the transfer, the 11-bit 2's
complement digital temperature (sent via the SIO line), is available in the
driver for interpretation. This driver makes use of the kernel's in-core
SPI support.
Signed-off-by: Kaiwan N Billimoria <kaiwan@designergraphix.com>
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
