Pull thermal management update from Zhang Rui:
"Highlights:
- Introduction of thermal policy support, together with three new
thermal governors, including step_wise, user_space, fire_share.
- Introduction of ST-Ericsson db8500_thermal driver and ST-Ericsson
db8500_cpufreq_cooling driver.
- Thermal Kconfig file and Makefile refactor.
- Fixes for generic thermal layer, generic cpucooling, rcar thermal
driver and Exynos thermal driver."
* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
Thermal: Fix DEFAULT_THERMAL_GOVERNOR
Thermal: fix a NULL pointer dereference when generic thermal layer is built as a module
thermal: rcar: add rcar_zone_to_priv() macro
thermal: rcar: fixup the unit of temperature
thermal: cpu cooling: allow module builds
thermal: cpu cooling: use const parameter while registering
Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.
Thermal: Add ST-Ericsson DB8500 thermal driver.
drivers/thermal/Makefile refactor
Exynos: Add missing dependency
Refactor drivers/thermal/Kconfig
thermal: cpu_cooling: Make 'notify_device' static
Thermal: Remove the cooling_cpufreq_list.
Thermal: fix bug of counting cpu frequencies.
Thermal: add indent for code alignment.
thermal: rcar_thermal: remove explicitly used devm_kfree/iounap()
thermal: user_space: Add missing static storage class specifiers
thermal: fair_share: Add missing static storage class specifiers
thermal: step_wise: Add missing static storage class specifiers
Thermal: Fix oops and unlocking in thermal_sys.c
...
CONFIG_HOTPLUG is going away as an option so __devexit is no
longer needed.
Signed-off-by: Bill Pemberton <wfp5p@virginia.edu>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
CONFIG_HOTPLUG is going away as an option so __devinit is no longer
needed.
Signed-off-by: Bill Pemberton <wfp5p@virginia.edu>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
In the context restore function, if the context is lost or
not is being checked by the contents of the counter register.
But this is logic hold good as long as counter reset value is
zero, if the reset value is non-zero then above logic doesn't
hold good. Hence removed checking of the register value and
restoring the context.
Signed-off-by: Radhesh Fadnis <radhesh.fadnis@ti.com>
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
For debugging purposes, print the IRQ event for the domain being processed.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
The API exposed by cpu cooling does not need any freq clip
table anymore. Now the cpu cooling device is smart enough
to build its own table.
For this reason, this patch removes all the code that is
generating a freq clip table and also removes all references
in data structures regarding freq clip table.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Because the driver is not really using platform data, this patch
removes the pdata nomenclature from this driver.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Because we are not including linux/io.h, the driver is not compiling.
This patch adds the missing header.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Conflicts:
drivers/staging/omap-thermal/omap-thermal-common.
OMAP supplied dummy TC1 and TC2,
at the same time that the thermal tree removed them
from thermal_zone_device_register()
drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
propogate the upstream MAX_IDR_LEVEL re-name
to prevent a build failure
Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Len Brown <len.brown@intel.com>
Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
There was an error in check for the valid temperature in
function temp_to_adc_conversion. The temperature value was
compared with higher limit for less than condition as well,
resulting in returning -EINVAL. Corrected the check condition
to properly check for lower and higher temperature limits.
Signed-off-by: Radhesh Fadnis <radhesh.fadnis@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
While registering the thermal zone, it is required to have the cooling
devices already setup, so that the .bind callback can succeed.
Due to that, the driver code needs to be reorganized so that we first
setup the cooling devices then the zones. This way we cope with the
right thermal framework initialization sequence.
This patch changes the order of the thermal zone initialization,
so that we create it only when the cooling devices are available.
It also adds some defensive checks for the config data, so that
the callbacks are ready for calls when the data is still not
initialized.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
While registering the omap thermal zones we need to
properly specify TC1 and TC2, as long as the proper
passive polling period and monitor period.
This patch fixes the parameters passed while registering
the thermal zone.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch adds the data structures needed for proper registration
of OMAP5 chips. This patch includes definitions for these chip versions:
. OMAP5430
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch adds the data structures needed for proper registration
of OMAP4 chips. This patch includes definitions for these chip versions:
. OMAP4430
. OMAP4460
. OMAP4470
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch has the common thermal framework support for OMAP
bandgap driver. It includes the zone registration and unregistration,
the cpu cooling and the trip definitions.
The trips definition is essentially one trip for passive cooling
using the generic cpu cooling device and another one for thermal
shutdown. The cpu cooling device is built based on the existing
cpu freq table. The build should be agnostic to omap version,
but relies that cpufreq is up and running by the time the driver
registers the cpu cooling, as it relies on the table walk api
from cpufreq.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
In the System Control Module, OMAP supplies a voltage reference
and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
This patch provides a platform driver which expose this feature.
It is moduled as a MFD child of the System Control Module core
MFD driver.
This driver provides only APIs to access the device properties,
like temperature, thresholds and update rate.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: J Keerthy <j-keerthy@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
