Pull thermal management updates from Zhang Rui:
"This time, the biggest change is the work of representing hardware
thermal properties in device tree infrastructure.
This work includes the introduction of a device tree bindings for
describing the hardware thermal behavior and limits, and also a parser
to read and interpret the data, and build thermal zones and thermal
binding parameters. It also contains three examples on how to use the
new representation on sensor devices, using three different drivers to
accomplish it. One driver is in thermal subsystem, the TI SoC
thermal, and the other two drivers are in hwmon subsystem.
Actually, this would be the first step of the complete work because we
still need to check other potential drivers to be converted and then
validate the proposed API. But the reason why I include it in this
pull request is that, first, this change does not hurt any others
without using this approach, second, the principle and concept of this
change would not break after converting the remaining drivers. BTW,
as you can see, there are several points in this change that do not
belong to thermal subsystem. Because it has been suggested by Guenter
R that in such cases, it is recommended to send the complete series
via one single subsystem.
Specifics:
- representing hardware thermal properties in device tree
infrastructure
- fix a regression that the imx thermal driver breaks system suspend.
- introduce ACPI INT3403 thermal driver to retrieve temperature data
from the INT3403 ACPI device object present on some systems.
- introduce debug statement for thermal core and step_wise governor.
- assorted fixes and cleanups for thermal core, cpu cooling, exynos
thrmal, intel powerclamp and imx thermal driver"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
thermal: remove const flag from .ops of imx thermal
Thermal: update thermal zone device after setting emul_temp
intel_powerclamp: Fix cstate counter detection.
thermal: imx: add necessary clk operation
Thermal cpu cooling: return error if no valid cpu frequency entry
thermal: fix cpu_cooling max_level behavior
thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST
thermal: debug: add debug statement for core and step_wise
thermal: imx_thermal: add module device table
drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c
thermal:samsung: fix compilation warning
thermal: imx: correct suspend/resume flow
thermal: exynos: fix error return code
Thermal: ACPI INT3403 thermal driver
MAINTAINERS: add thermal bindings entry in thermal domain
arm: dts: make OMAP4460 bandgap node to belong to OCP
arm: dts: make OMAP443x bandgap node to belong to OCP
arm: dts: add cooling properties on omap5 cpu node
arm: dts: add omap5 thermal data
arm: dts: add omap5 CORE thermal data
...
This patch provides auto disable/enable operation for boost. It uses already
present thermal infrastructure to provide BOOST hysteresis.
The TMU data is modified to work properly with or without BOOST.
Hence, the two first trip points with corresponding clip frequencies are
adjusted.
The first one is reduced from 85 to 70 degrees and the clip frequency is
increased to 1.4 GHz from 800 MHz. This trip point is in fact responsible
for providing BOOST hysteresis. When temperature exceeds 70 deg, the maximal
non BOOST frequency for Exynos4412 is imposed.
Since the first trigger level has been "stolen" for BOOST, the second one
needs to be a compromise for the previously used two for non BOOST
configuration. The 95 deg with modified clip freq (to 400 MHz) should provide
a good balance between cooling down the overheated device and throughput on
an acceptable level.
Two last trigger levels are not modified since, they cause platform shutdown
on emergency overheat to happen.
The third trip point passage results in SW managed shut down of the system.
If the last trip point is crossed, the PMU HW generates the power off
signal.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Myungjoo Ham <myungjoo.ham@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
[rjw: Changelog]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
This patch fixes a compilation warning.
warning: passing argument 5 of 'thermal_zone_device_register' discards 'const'
qualifier from pointer target type [enabled by default]
include/linux/thermal.h:270:29: note: expected 'struct thermal_zone_device_ops *'
but argument is of type 'const struct thermal_zone_device_ops *'
Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Set the return variable to an error code as done elsewhere in the function.
A simplified version of the semantic match that finds this problem is as
follows: (http://coccinelle.lip6.fr/)
// <smpl>
(
if@p1 (\(ret < 0\|ret != 0\))
{ ... return ret; }
|
ret@p1 = 0
)
... when != ret = e1
when != &ret
*if(...)
{
... when != ret = e2
when forall
return ret;
}
// </smpl>
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Reviewed-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The commit d0a0ce3e77 ("thermal: exynos: Add
missing definations and code cleanup") has removed setting of test MUX address
value at TMU configuration setting.
This field is not present on Exynos4210 and Exynos5 SoCs. However on Exynos4412
SoC it is required to set this field after reset because without it TMU shows
maximal available temperature, which causes immediate platform shutdown.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Up till now Exynos5250 and Exynos4412 had the same definitions for TMU
data. Following commit changes that, by introducing separate
exynos4412_default_tmu_data structure.
Since Exynos4412 was chronologically first, the corresponding name for
TMU registers and default data was renamed.
Additionally, new SOC_ARCH_EXYNOS4412 type has been defined.
Moreover, the SOC_ARCH_EXYNOS name has been changed to SOC_ARCH_EXYNOS5250.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
The commit 4de0bdaa96
("thermal: exynos: Add support for instance based register/unregister")
broke check for presence of therm_dev at global thermal zone in
exynos_report_trigger().
The resulting wrong test prevents thermal_zone_device_update() call, which
calls handlers for situation when trip points are passed.
Such behavior prevents thermal driver from proper reaction (when TMU interrupt
is raised) in a situation when overheating is detected at TMU hardware.
It turns out, that after exynos thermal subsystem redesign (at v3.12) this
check is not needed, since it is not possible to register thermal zone
without valid thermal device.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Commit 1cd1ecb6 ("thermal: exynos: Remove non DT based support")
cleaned up some non-DT code. However, there were few more things
needed for complete cleanup to make this driver DT only.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
NULL pointer was being dereferenced in its own error message.
Changed it to the correct device pointer.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
The error check is checking for a "base" mapped memory base
instead of "base_common". Fixing the same.
Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
TMU probe function now checks for a device tree defined regulator.
For compatibility reasons it is allowed to probe driver even without
this regulator defined.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds support for h/w mode calibration in the TMU controller.
Soc's like 5440 support this features. The h/w bits needed for calibration
setting are same as that of enum calibration_type.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch sets the second point trimming value according to the platform
data if the register value is 0.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds configuration data for exynos5440 soc. Also register
definations for the controller are added.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch modifies TMU controller to add changes needed to work with
exynos5440 platform. This sensor registers 3 instance of the tmu controller
with the thermal zone and hence reports 3 temperature output. This controller
supports upto five trip points. For critical threshold the driver uses the
core driver thermal framework for shutdown.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Jungseok Lee <jays.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds support to parse one more common set of TMU register. First
set of register belongs to each instance of TMU and second set belongs to
common TMU registers.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch uses the device pointer stored in the configuration structure
and converts to dev_* prints and devm API's.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds several features supported by TMU as bitfields.
This features varies across different SOC type and comparing
the features present in the TMU is more logical than comparing
the soc itself.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds support to handle multiple instances of the TMU controllers.
This is done by removing the static structure to register with the core thermal
and creating it dynamically for each instance of the TMU controller. The
interrupt is made shared type to handle shared interrupts. Now since the ISR needs
the core thermal framework to be registered so request_irq is moved after the core
registration is done.
Also the identifier of the TMU controller is extracted from device tree alias. This
will be used for TMU specific initialisation.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Recently non DT support from Exynos platform is removed and hence
removing non DT support from the driver also. This will help in easy
maintainence.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code simplifies the zone handling to use the trip information passed
by the TMU driver and not the hardcoded macros. This also helps in adding
more zone support.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch removes the error return in the bind/unbind routine
as the platform may not register any cpufreq cooling data.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch renames member private_data to driver_data of the thermal
zone registration structure as this item stores the driver related
data and uses it to call the driver related callbacks.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code modifies the thermal driver to have multiple thermal zone
support by replacing the global thermal zone variable with device data
member of thermal_zone_device.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch uses the TMU status register to know the generated interrupts
and only clear them in the interrupt handler.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
TMU urgently sends active-high signal (thermal trip) to PMU, and thermal
tripping by hardware logic. Thermal tripping means that PMU cuts off the
whole power of SoC by controlling external voltage regulator.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Jonghwan Choi <jhbird.choi@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch migrates the TMU register definition/bitfields to data file. This
is needed to support SoC's which use the same TMU controller but register
validity, offsets or bitfield may slightly vary across SOC's.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds entries min_efuse_value, max_efuse_value, default_temp_offset,
trigger_type, cal_type, trim_first_point, trim_second_point, max_trigger_level
trigger_enable in the TMU platform data structure. Also the driver is modified
to use the data passed by these new platform memebers instead of the constant
macros. All these changes helps in separating the SOC specific data part from
the TMU driver.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds some extra register bitfield definations and cleans
up the code to prepare for moving register macros and definations inside
the TMU data section. In this code cleanup the TMU enable bit is correctly used
as bit0 and bit1 is taken care which is reserve bit.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code splits the exynos tmu driver code into SOC specific data parts.
This will simplify adding new SOC specific data to the same TMU controller.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch renames and moves include/linux/platform_data/exynos_thermal.h to
drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos
SOC's are not supporting non-DT based platforms and this file now just contains
exynos tmu driver related definations.
Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes
the compilation issue occuring because now this new tmu header file is included
in tmu driver c file and not in the common thermal header file.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch renames exynos_thermal.c to exynos_tmu.c. This change is needed as
this file now just contains exynos tmu driver related codes and thermal zone
or cpufreq cooling registration related changes are not there anymore.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code bifurcates exynos thermal implementation into common and sensor
specific parts. The common thermal code interacts with core thermal layer and
core cpufreq cooling parts and is independent of SOC specific driver. This
change is needed to cleanly add support for new TMU sensors.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch removes the dependency on CPU_THERMAL for compiling TMU driver.
This is useful for cases when only TMU controller needs to be initialised
without cpu cooling action.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch uses the recently added config sybmol ARCH_HAS_BANDGAP to enable
the TMU driver. This will allow adding support for new soc easily as now it
is the platform responsibility to enable this config symbol for a particular
soc.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
