thermal: fix thermal_zone_bind_cooling_device prototype
When the prototype for thermal_zone_bind_cooling_device
changed, the static inline wrapper function was left alone,
which in theory can cause build warnings:
I have seen this error in the past:
drivers/thermal/db8500_thermal.c: In function 'db8500_cdev_bind':
drivers/thermal/db8500_thermal.c:78:9: error: too many arguments to function 'thermal_zone_bind_cooling_device'
ret = thermal_zone_bind_cooling_device(thermal, i, cdev,
while this one no longer shows up, there is no doubt that
the prototype is still wrong, so let's just fix it anyway.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: 6cd9e9f629
("thermal: of: fix cooling device weights in device tree")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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1 changed files with 2 additions and 1 deletions
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@ -438,7 +438,8 @@ static inline void thermal_zone_device_unregister(
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static inline int thermal_zone_bind_cooling_device(
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struct thermal_zone_device *tz, int trip,
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struct thermal_cooling_device *cdev,
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unsigned long upper, unsigned long lower)
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unsigned long upper, unsigned long lower,
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unsigned int weight)
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{ return -ENODEV; }
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static inline int thermal_zone_unbind_cooling_device(
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struct thermal_zone_device *tz, int trip,
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